3. Thin Film Deposition
3.2 Plasma Deposition
Sputtering
- TMV Super Series SS-40C-IV Multi Cathode Sputtering system
- Precious Metals: Pt, Au, Ir
- Adhesion Layers: Ti, Cr, TiW
- Denton Discovery 18 sputter system
Evaporation
- Denton DV-SJ/20C e-beam evaporator
- CHA 600 thermal evaporator
- Evaporation Materials Available: Al, Ag, Au, Au/Ge, Cr, Cu, Ge, In, Mo, NiCr, Nb, Ni, Ta, Ti, W, Zn
Electrodeposition
- Custom electroplating system
- Electrodeposition Materials and Chemicals Available: Cu and Ni source material and plating solution
3.2 Plasma Deposition
PECVD
- Oxford Plasmalab 80 Plus
- Si3N4, SiONx, SiO2
- Oxford Plasmalab 100 ICP/PECVD
- SiC