8. Backend processing
Sample Prep. And Cross Sectioning
- Precision CMP (chemical mechanical polishing)/planarization tool (Allied Hi-Tech)
- Strasbaugh CMP Model 6EC Laboratory Planarizer
- Slow-speed diamond saw (Allied Hi-Tech)
- DISCO Programmable silicon dicing saw (Disco)
Packaging
- Wirebonder/wedgebonder
- Wirebonder (gold ball bonder)
- Paratech LP3000 Parylene-C deposition system