Nanofab News Item
New equipment installed and more planned
New equipment installed in the MEB interim microfab and surface analysis lab.
New equipment installed in the MEB interim microfab includes new wet and dry benches, DRIE, two Lam etchers (polySi and nitride), a Flexus wafer stress measurement system, a nanospec oxide film thickness measurement system, a XeF2 polysilicon and bulk silicon isotropic etch tool, an automated new CMP tool, PR spinners, bake ovens and donated pumps and HMDS vapor prime. For information on training and use of these tools, see our staff engineers, Brian Baker and Justin Millis.
In the surface lab we have a new microspot (mapping x-ray fluorescence) XRF and an attachment for the SEM enabling electron diffraction mapping for grain orientation imaging.
See www.surface.utah.edu