10. Affiliated Laboratories

  1. SEM Lab: Hitachi S-3000 LV-SEM / EDS / BSE and crystal orientation imaging systems.
  2. TEM Lab: JEOL 2000FX II high-resolution electron microscope with EDXS attachment capable of detecting down to Boron. Accessories include high and low temperature in situ straining stage, double tilt holder suitable for crystallographic analysis. Peripheral equipment for electrolytic foil preparation as well as ion milling of thin foils is also available.
  3. X-ray Lab: Siemens D5000 X-ray diffraction unit with facility (Rigaku/Bede) to perform double crystal diffraction analysis is available for diffraction analysis, if needed.
  4. Metallography Lab: Allied HiTec sample polishing capability for precision parallel lapping and cross-sectioning. Precision parallel lapping and CMP. Various metallographic scopes, fume hood, hardness testing, 1000X optical microscopy with differential interference contrast and digital micrography.
  5. Metrology lab with Dektak stylus profilometry, Nikon Optical comparator, and Digital Instruments Dimension 3000 AFM (100x100x2 micron scan field) with tapping & contact mode, STM, MFM, and nanoMAN also possible. Reliability characterization by electrodynamic four-point cyclic bending fixture.
  6. Microtomography Lab: MicroCT, a MicroSystem characterization instrument developed in the Metallurgy department utilizing highly focused X-rays to provide 3-D internal rendering of MicroSystems at resolution of 5-20 microns.
  7. Sonix Scanning Acoustic Tomography system for use in detecting bulk material voids, interfacial delaminations, and cracks.
  8. CADE lab: SUN Solaris machines to run Finite element analysis (FEA). Also available: IntellisuiteMEMS design and modeling software, and Pro/ENGINEER.
  9. 50 Educational licenses for ANSYS 6.0 to perform computer modeling and simulation.
  10. Access to Utah High Performance Computing Center (UHPC) where extensive high speed computational hardware as well as several materials simulation software packages are available.

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